Single event effect hardness for the front-end ASICs in the DAMPE satellite BGO calorimeter

Shan-Shan Gao; Di Jiang; Chang-Qing Feng; Kai Xi; Shu-Bin Liu; Qi An

doi:10.1088/1674-1137/40/1/016102

Chinese Physics C> 2016, Vol. 40> Issue(1) : 016102 DOI: 10.1088/1674-1137/40/1/016102

Single event effect hardness for the front-end ASICs in the DAMPE satellite BGO calorimeter

Shan-Shan Gao ^1,2,, ,
Di Jiang ^1,2 ,
Chang-Qing Feng ^1,2,, ,
Kai Xi ³ ,
Shu-Bin Liu ^1,2 ,
Qi An ^1,2

1.
State Key Laboratory of Particle Detection and Electronics, University of Science and Technology of China, Hefei 230026, China
2.
Department of Modern Physics, University of Science and Technology of China, Hefei 230026, China
3.
Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000, China

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Abstract：
The Dark Matter Particle Explorer (DAMPE) is a Chinese scientific satellite designed for cosmic ray studies with a primary scientific goal of indirect detection of dark matter particles. As a crucial sub-detector, the BGO calorimeter measures the energy spectrum of cosmic rays in the energy range from 5 GeV to 10 TeV. In order to implement high-density front-end electronics (FEE) with the ability to measure 1848 signals from 616 photomultiplier tubes on the strictly constrained satellite platform, two kinds of 32-channel front-end ASICs, VA160 and VATA160, are customized. However, a space mission period of more than 3 years makes single event effects (SEEs) become threats to reliability. In order to evaluate SEE sensitivities of these chips and verify the effectiveness of mitigation methods, a series of laser-induced and heavy ion-induced SEE tests were performed. Benefiting from the single event latch-up (SEL) protection circuit for power supply, the triple module redundancy (TMR) technology for the configuration registers and the optimized sequential design for the data acquisition process, 52 VA160 chips and 32 VATA160 chips have been applied in the flight model of the BGO calorimeter with radiation hardness assurance.
- space electronics ,
- single event effects ,
- radiation hardness ,
- heavy ion ,
- pulsed laser

References

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Shan-Shan Gao, Di Jiang, Chang-Qing Feng, Kai Xi, Shu-Bin Liu and Qi An. Single event effect hardness for the front-end ASICs in the DAMPE satellite BGO calorimeter[J]. Chinese Physics C, 2016, 40(1): 016102. doi: 10.1088/1674-1137/40/1/016102

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Received: 2015-06-24
Revised: 2015-08-31

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Supported by Strategic Priority Research Program on Space Science of the Chinese Academy of Sciences (XDA04040202-4) and Fundamental Research Funds for the Central Universities (WK2030040048)

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通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

Single event effect hardness for the front-end ASICs in the DAMPE satellite BGO calorimeter

Corresponding author: Shan-Shan Gao,

Corresponding author: Chang-Qing Feng,

1. State Key Laboratory of Particle Detection and Electronics, University of Science and Technology of China, Hefei 230026, China

2. Department of Modern Physics, University of Science and Technology of China, Hefei 230026, China

3. Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000, China

Received Date: 2015-06-24

Accepted Date: 2015-08-31

Available Online: 2016-01-20

Fund Project: Supported by Strategic Priority Research Program on Space Science of the Chinese Academy of Sciences (XDA04040202-4) and Fundamental Research Funds for the Central Universities (WK2030040048)

Abstract: The Dark Matter Particle Explorer (DAMPE) is a Chinese scientific satellite designed for cosmic ray studies with a primary scientific goal of indirect detection of dark matter particles. As a crucial sub-detector, the BGO calorimeter measures the energy spectrum of cosmic rays in the energy range from 5 GeV to 10 TeV. In order to implement high-density front-end electronics (FEE) with the ability to measure 1848 signals from 616 photomultiplier tubes on the strictly constrained satellite platform, two kinds of 32-channel front-end ASICs, VA160 and VATA160, are customized. However, a space mission period of more than 3 years makes single event effects (SEEs) become threats to reliability. In order to evaluate SEE sensitivities of these chips and verify the effectiveness of mitigation methods, a series of laser-induced and heavy ion-induced SEE tests were performed. Benefiting from the single event latch-up (SEL) protection circuit for power supply, the triple module redundancy (TMR) technology for the configuration registers and the optimized sequential design for the data acquisition process, 52 VA160 chips and 32 VATA160 chips have been applied in the flight model of the BGO calorimeter with radiation hardness assurance.

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Single event effect hardness for the front-end ASICs in the DAMPE satellite BGO calorimeter

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