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Abstract:
The complex scattering process of the high-energy(50keV≤E0≤100keV) electron beams with the Gaussian distribution in resist is simulated by Monte Carlo method with different energy range models. The backscatter coefficient of electrons and energy deposition distributions are presented under different exposure conditions. The simulation results are in good agreement with the experimental data. It is found that, in the energy range 50keV≤E0≤100keV, higher electron beam energy, thinner resist and lower substrate's atom number will cause lower proximity effect, which agrees with the corresponding experiment. The present results not only can help to optimize the exposure conditions in Electron Beam Lithography, but also supply more accurate data for proximity effect correction.
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